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58 Pcs. in stock
Planned delivery time
Ø 1 Week
Life Cycle Status
The life cycle indicates which market phase the item is in. We distinguish between:
• Active (green)
• NRND = Not Recommended for New Designs (yellow)
• LTB = Last Time Buy (yellow)
• EOL = End of Life (red)
Bonding of metal; plastic; fibre-reinforced materials; ceramics; glass; stone; wood
Packaging (ml)
24 ml
Features
This transparent adhesive retains elasticity after curing and is ideal for jobs in construction and assembly. - Viscous, self-levelling - Very short pot life (3-4 minutes) - Fast-curing - Almost colourless, glass clear - Temperature resistance range: -50°C to +80°C
Operating conditions
Temperature resistance, min.
-50 °C
Temperature resistance, max.
80 °C
Storage
When stored in unopened condition in a dry place at constant room temperature of approx. +20°C, WEICON Epoxy Adhesives have a shelf life of at least 18 months. Protect from direct sunlight. In case of non-observance of these storage instructions, the shelf life is reduced to 6 six months. In general, epoxy resins tend to crystallise at temperatures below +5°C. This effect is increased by large temperature fluctuations, e.g. during transport especially in the winter months. This has a negative impact on processing, curing and technical data, can, however, be reversed by heating the product (up to max. +50°C, no open flame). In WEICON Epoxy Adhesives, crystallisation is reduced by the careful choice and combinations of base resins (bisphenol A and F).
Safety/Certifications
Directions
WEICON Easy-Mix products can be processed straight from the double cartridge by means of the included static mixer. Dismiss the first 5 cm of the adhesive bead. The adhesive is applied to just one side. The specified pot life refers to a material batch of 10 ml at room temperature. Larger batch quantities will result in faster curing. Higher temperatures also reduce the pot life and curing time. (General rule: every increase by +10 °C above room temperature results in a decrease of the pot life and curing time by half). Temperatures below +16 °C increase the pot life and curing time significantly. From approx. +5C and below, no reaction takes place.
