696001

Stencil printing

- "No-clean" solder paste
- Solder powder made from recycled solder 
- 85 percent CO2 savings 
- Very suitable for use with low silver content (TSC105) 
- Suitable for fine pitch up to 0,4 mm 
- Very good first print results after longer printer downtime 
- Reflow process under air or nitrogen possible 
- Very good wetting on most surfaces

At a storage temperature of 2 to 8 °C, the minimum shelf life (from date of manufacture) is 6 months in the unopened original container. Solder paste in cartridges (Semco 6 oz and 12 oz) should be stored upright with the cap of the dispensing opening facing downwards. If this is not possible, we recommend turning the lying cartridges by 180° once a week to avoid separation. Allow the solder paste to warm up to room temperature in the closed original container for approx. 2 hours before processing to prevent condensation of humidity on the surface.

Recommendations for solder paste printing:
1. Generally, use the thinnest stencil possible.
2. Use stencils with rounded corners to minimise clogging of the stencil openings.
3. Set the squeegee pressure to 0.25 kg/cm squeegee length. Then reduce the squeegee pressure in small steps until the solder paste starts to smear. Now the squeegee force is set to the optimum. Make these adjustments at your desired print speed.
4. The optimum printing speed with the SP6000 solder paste is in the range of 20-100 mm sec-1 .
5. Pay close attention to the sealing of the PCB and stencil. The PCB must be very well supported in order to seal against the stencil and the solder paste cannot be pushed sideways past the pads.