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• Active (green)
• NRND = Not Recommended for New Designs (yellow)
• LTB = Last Time Buy (yellow)
• EOL = End of Life (red)
Manufacturer's packaging unit (Mfr. PU) means the smallest original packaging unit of the manufacturer.
Price per 1 Pcs.
Quantity and Options
(at least 10 or multiple of 10)
All prices net plus VAT. We do not deliver to private customers.
Fact Sheet
Leaded
false
Alloy
Sn96,5Ag3Cu0,5
Flux type (IPC-J-STD-004)
REL0
RoHS-Conform
Specifications
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General
Manufacturer
Stannol
Product Family
SP2200
Type
Soldering Paste
Series
SP2200
Product group
R5261
Application
Stencil printing
Leaded
Alloy
Sn96,5Ag3Cu0,5
Packaging (g)
500 g
Flux type (IPC-J-STD-004)
REL0
Features
- "No-clean" Solder paste - Very good printing after extended printer downtime - Reflow possible under air or nitrogen - Very good wetting on all surfaces, including Ni and Pd - High wet adhesive strength for use on high-speed assembly machines - Very suitable for large-area soldering - Suitable for fine pitch down to 0,4mm - Contains a highly active type L no-clean flux
Operating conditions
Density (20°C)
3.9 g/cm3
Melting range, min.
217 °C
Melting range, max.
223 °C
Viscosity, min.
550.000 cPs (25°C)
Viscosity, max.
850.000 cPs (25°C)
Storage
At a storage temperature of 2–8 °C, the minimum shelf life (from the date of manufacture) is 6 months (tin) or 3 months (cartridge) in the unopened original container. Solder paste in cartridges (Semco 6 & 12 oz) or syringes (≤ 30 cc) should be stored upright with the cap on the dispensing opening facing downwards. If this is not possible, we recommend rotating cartridges stored horizontally by 180° once a week to prevent separation. Before use, allow the solder paste to warm slowly to room temperature for approx. 8–12 hours in its original, sealed container to prevent condensation from atmospheric moisture forming on the surface.
Shelf Life
6 Monate
Safety/Certifications
Directions
Recommendation for solder paste printing: 1. Use always the thinnest possible stencil thickness. 2. Use always stencils with rounded corners, to reduce clogging of apertures to the lowest possible minimum. 3. Set the squeegee pressure to 1kg for each 5cm of squeegee length. Then reduce the pressure step by step, till the solder paste starts smearing on the stencil. Then add 1kg to the squeegee pressure and check, that the solder paste leaves no residues after printing on the surface of the stencil. Evaluate this parameter at your desired print speed. 4. Optimum print results can be achieved at print speeds between 10-75 mm sec-1. 5. Please ensure a perfect sealing between PCB and stencil. The PCB has to have the best possible support, to achieve the optimum sealing to the stencil, so that the solder paste cannot be printed between pads and stencil. This avoids solder balling. 6. Printer down times up to 60min can be achieved. The following first print after 1h should give good filling of apertures and a good print result.
