ICK BGA 14 X 14

Fischer Elektronik BGA heatsinks ICK BGA anodized black Bonding 14mm 14mm

Manufacturer Part No.
ICK BGA 14 X 14
Schukat Part No.
ICKBGA14X14
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305 Pcs. in stock

Planned delivery time
Ø 15 Weeks
Life Cycle Status
The life cycle indicates which market phase the item is in. We distinguish between: • Active (green) • NRND = Not Recommended for New Designs (yellow) • LTB = Last Time Buy (yellow) • EOL = End of Life (red)
Active
Available (from stock)
Replacement / Follow-up View entire series
Data Sheet
ECAD Model
Downloads

Prices

Manufacturer bundle 10 Pcs.
Manufacturer's packaging unit (Mfr. PU) means the smallest original packaging unit of the manufacturer.
Price per 1 Pcs.

Quantity and Options

(at least 5 or multiple of 5)
All prices net plus VAT. We do not deliver to private customers.

Fact Sheet

Type
BGA heatsinks
Series
ICK BGA
Colour
black
Assembly Type
Bonding
Dimension: Length
14 mm
Dimension: Width
14 mm
Dimension: Height
6 mm
Thermal resistance
30 K/W
RoHS-Conform

Specifications

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General

Manufacturer
  • Fischer Elektronik
Type
  • BGA heatsinks
Series
  • ICK BGA
Product group
  • G9631 Heatsinks for Ball Grid Array (BGA)
Finished
  • anodized
Colour
  • black
Assembly Type
  • Bonding
Motor Position
  • N/A
Cell size
  • PGA/BGA
Features
  • - Excellent thermal efficiency achieved by flow-favorable omnidirectional fin geometry
    - Easy mounting using thermally conductive adhesive foil or thermally conductive glue

Dimensions and weights

Dimension: Length
  • 14 mm
Dimension: Width
  • 14 mm
Dimension: Height
  • 6 mm

Technical features

Thermal resistance
  • 30 K/W