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2.000 Pcs. in stock
Planned delivery time
Ø 6 Weeks
Life Cycle Status
The life cycle indicates which market phase the item is in. We distinguish between:
• Active (green)
• NRND = Not Recommended for New Designs (yellow)
• LTB = Last Time Buy (yellow)
• EOL = End of Life (red)
Active
Available (from stock)
Data Sheet
ECAD Model
Prices
Manufacturer bundle 2000 Pcs.
Manufacturer's packaging unit (Mfr. PU) means the smallest original packaging unit of the manufacturer.
Price per 1 Pcs.
Quantity and Options
(at least 1 or multiple of 1)
All prices net plus VAT. We do not deliver to private customers.
Fact Sheet
- Manufacturer Package
- QFN-56
- CPU Core
- Xtensa LX7
- CPU Architecture
- Xtensa
- Program Memory Size
- 384 KB
- Memory Size
- 512 KB
- Number of I/O Pins
- 45 I/O
- Transmission Protocol
- IEEE 802.11b/g/n; 2.4 GHz; HT20/40; up to 150 Mbps
- Supply Voltage Min.
- 3 V
- Supply Voltage Max.
- 3.6 V
- Interfaces
- I2C_2x
I2S_2x
SPI_4x
UART_3x
USB_1x - RoHS-Conform
Specifications
Open all
Operating conditions
- Operating Temperature, min. (TA)
- -40 °C
- Operating Temperature, max. (TA)
- 85 °C
- Storage Temperature Min.
- -40 °C
- Storage Temperature Max.
- 150 °C
Electrical Properties
- CPU Architecture
- Xtensa
- Number of Processor Core
- 2
- GPIO
- 45
- Transmission Protocol
- IEEE 802.11b/g/n; 2.4 GHz; HT20/40; up to 150 Mbps
- CPU Core
- Xtensa LX7
- Bluetooth
- Bluetooth LE v5.0
- USB Modus
- Device/Host/OTG
- Security
- 4k OTP, AES, SHA, RSA, ECC RNG, Secure Boot, Flash Encryption, Digital Signature, HMAC
- Transmission Frequency
- 2.4 GHz
- Data Rate Max.
- 150 Mb/s
- Supply Voltage Min.
- 3 V
- Supply Voltage Max.
- 3.6 V
- Flash
- 8 MB
- Flash SPI
- Quad
- SRAM
- 512 KB
- ROM
- 384 KB
- Interfaces
- I2C_2x
- I2S_2x
- SPI_4x
- UART_3x
- USB_1x
- Real-Time Clock
- Number of PWM Channels
- 8
- Number of ADC Channels
- 2(10)
- ADC Resolution
- 12 bit
- USB Speed
- FS
- Crypto Engine
- USB OTG
- Program Memory Size
- 384 KB
- Memory Size
- 512 KB
- Number of I/O Pins
- 45 I/O
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