Home
Login
Cart
HomeProductsEmbedded SolutionsWireless ModulesESP32-D0WDESP32-D0WD-V3

ESP32-D0WD-V3

Espressif Systems SoC 448KB 34I/O 240MHz 520KB QFN-48 IEEE 802.11 b/g/n; 2.4 GHz; HT20/40; up to 150 Mbps

Manufacturer Part No.
ESP32-D0WD-V3
Schukat Part No.
ESP32-D0WD-V3
Manufacturer
Espressif Systems
Enter your company's part number here. Your part number will be referenced on your receipts, such as the order confirmation, invoice or delivery note.
Enter your personal project number here to assign the item to a project. Your part project number will be referenced on your receipts, such as the order confirmation, invoice or delivery note.

0 Pcs. in stock

Back Order
5.000 Pcs.
Planned delivery time
Ø 10 Weeks
Life Cycle Status
The life cycle indicates which market phase the item is in. We distinguish between: • Active (green) • NRND = Not Recommended for New Designs (yellow) • LTB = Last Time Buy (yellow) • EOL = End of Life (red)
Active
Available on order
Replacement / Follow-up View entire series
Data Sheet
Open PDF
ECAD Model
Downloads

Prices

Manufacturer bundle 5000 Pcs.
Manufacturer's packaging unit (Mfr. PU) means the smallest original packaging unit of the manufacturer.
Price per 1 Pcs.

Quantity and Options

(at least 5000 or multiple of 5000)
All prices net plus VAT. We do not deliver to private customers.

Fact Sheet

Manufacturer Package
QFN-48
CPU Architecture
Xtensa
CPU clock frequency Max.
240 MHz
Program Memory Size
448 KB
Memory Size
520 KB
Number of I/O Pins
34 I/O
Transmission Protocol
IEEE 802.11 b/g/n; 2.4 GHz; HT20/40; up to 150 Mbps
Supply Voltage Min.
2.3 V
Supply Voltage Max.
3.6 V
Interfaces
CAN (TWAI)_1x
I2C_2x
I2S_2x
SPI_4x
UART_3x
RoHS-Conform

Specifications

Open all

General

Manufacturer
  • Espressif Systems
Type
  • SoC
Series
  • ESP32-D0WD
Product group
  • Y5727
Dimension: Length
  • 5 mm
Dimension: Width
  • 5 mm
Dimension: Height
  • 0.85 mm
Packaging
  • Reel
Assembly Type
  • SMD/SMT
Pin Count
  • 48
Manufacturer Package
  • QFN-48

Operating conditions

Operating Temperature Min.
  • -40 °C
Operating Temperature Max.
  • 125 °C

Electrical Properties

CPU Architecture
  • Xtensa
Number of Processor Core
  • 2
Transmission Protocol
  • IEEE 802.11 b/g/n; 2.4 GHz; HT20/40; up to 150 Mbps
Bluetooth
  • BR/EDR + Bluetooth LE v4.2
Security
  • 1k OTP, AES, SHA, RSA, ECC, RNG, Secure Boot, Flash Encryption
Transmission Frequency
  • 2.4 GHz
CPU clock frequency Max.
  • 240 MHz
Data Rate Max.
  • 150 Mb/s
Supply Voltage Min.
  • 2.3 V
Supply Voltage Max.
  • 3.6 V
Flash
  • 0 MB
SRAM
  • 520 KB
ROM
  • 448 KB
PSRAM
  • 0 MB
Interfaces
  • CAN (TWAI)_1x
  • I2C_2x
  • I2S_2x
  • SPI_4x
  • UART_3x
Real-Time Clock
Number of PWM Channels
  • 16
Number of ADC Channels
  • 1(8) 1(10)
ADC Resolution
  • 12 bit
Ethernet Speed
  • RMII
Crypto Engine
USB OTG
Program Memory Size
  • 448 KB
Memory Size
  • 520 KB
Number of I/O Pins
  • 34 I/O